Specification | |
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Processor | 2U Rackmount Dual 3rd Gen Intel Xeon Scalable Processor (Ice Lake-SP) |
CPU | Support Dual 3rd Gen Intel Xeon Scalable Processor(Ice Lake-SP), Socket P+,4189pin |
Chipset | Intel® Lewisburg C621A/C627A PCH (by SKUs) |
System Bus | UPI up to 11.2GT/s |
BIOS | AMI® UEFI BIOS |
memory | Total 16 DIMMs (8 channels per CPU, 1x DIMM per channel, 8 DIMMs per CPU) -- ECC & Registered RDIMM:DDR4 2933/3200 MHz memory, up to 128GB per DIMM --LRDIMM:DDR4 2933/3200 MHz, up to 128GB per DIMM |
Capacity | ECC RDIMM / LRDIMM up to 2TB total |
Expansion | 8x PCIe Gen4 x8 slots for NIC module 2x M.2、one CF/mSATA/miniPCI-E, 2x internalSlimSAS 8i connector 1x rear PCIe x8 slot for Standard PCIe card (Optional) |
GbE Ethernet | 2x RJ45 1GbE ports in system front |
SATA | Support 2x 2.5” SATA HDD or SSD |
M2 | 2x M.2 2280 socket (M-Key) |
Compact Flash Socket | Either for CompactFlash/mSATA/miniPCIe (Co-Layout) |
Serial Port | 1x RJ45 Console port (COM1) 2x internal pin header (COM2 & COM3) |
USB | 2x external USB 2.0 port 1x internal USB 3.0 pin header |
Power | 850W Redundant powersupply (CRPS), 12V output / RoHSOPERATION |
LED | 1x Power LED (Green) 1x HDD LED (Red) 2x Status LED(Green/Yellow via programmable GPIO) |
Dimension | 440mm(W) x 600 mm(D) x 88mm(H) |
Operating Environment | Operating: 0 ~ 40°C ( 32 ~ 104°F ) |
Storage Environment | -20 ~ 75°C (-4 ~ 167°F) |
Humidity | 10 ~ 85% relative humidity, nonoperating, non-condensing |
Weight | 21 kg |
Certification | CE/FCC |
Ordering Guide | |
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APTNS-33281 | 2U Rackmount Dual 3rd Gen Intel Xeon Scalable Processor (Ice Lake-SP) and Intel® C621A/C627A PCH |