| Specification | |
|---|---|
| Processor | 2U Rackmount Dual 3rd Gen Intel Xeon Scalable Processor (Ice Lake-SP) |
| CPU | Support Dual 3rd Gen Intel Xeon Scalable Processor(Ice Lake-SP), Socket P+,4189pin |
| Chipset | Intel® Lewisburg C621A/C627A PCH (by SKUs) |
| System Bus | UPI up to 11.2GT/s |
| BIOS | AMI® UEFI BIOS |
| memory | Total 16 DIMMs (8 channels per CPU, 1x DIMM per channel, 8 DIMMs per CPU) -- ECC & Registered RDIMM：DDR4 2933/3200 MHz memory, up to 128GB per DIMM --LRDIMM：DDR4 2933/3200 MHz, up to 128GB per DIMM |
| Capacity | ECC RDIMM / LRDIMM up to 2TB total |
| Expansion | 8x PCIe Gen4 x8 slots for NIC module 2x M.2、one CF/mSATA/miniPCI-E, 2x internalSlimSAS 8i connector 1x rear PCIe x8 slot for Standard PCIe card (Optional) |
| GbE Ethernet | 2x RJ45 1GbE ports in system front |
| SATA | Support 2x 2.5” SATA HDD or SSD |
| M2 | 2x M.2 2280 socket (M-Key) |
| Compact Flash Socket | Either for CompactFlash/mSATA/miniPCIe (Co-Layout) |
| Serial Port | 1x RJ45 Console port (COM1) 2x internal pin header (COM2 & COM3) |
| USB | 2x external USB 2.0 port 1x internal USB 3.0 pin header |
| Power | 850W Redundant powersupply (CRPS), 12V output / RoHSOPERATION |
| LED | 1x Power LED (Green) 1x HDD LED (Red) 2x Status LED(Green/Yellow via programmable GPIO) |
| Dimension | 440mm(W) x 600 mm(D) x 88mm(H) |
| Operating Environment | Operating: 0 ~ 40°C ( 32 ~ 104°F ) |
| Storage Environment | -20 ~ 75°C (-4 ~ 167°F) |
| Humidity | 10 ~ 85% relative humidity, nonoperating, non-condensing |
| Weight | 21 kg |
| Certification | CE/FCC |
| Ordering Guide | |
|---|---|
| APTNS-33281 | 2U Rackmount Dual 3rd Gen Intel Xeon Scalable Processor (Ice Lake-SP) and Intel® C621A/C627A PCH |
