EG520-E11-RS6-F

Intel Single-Socket, 2U Edge Server based on 4th/5th Gen Intel® Xeon® Scalable Processors



Features

  • 8 x DDR5 5600 Mhz DIMM support
  • 2 x M.2 socket support
  • Powered by single-socket 5th Gen Intel® Xeon® Scalable processors
  • 5 x PCIe expansion in 2U rack sever
  • Support GPUs in short-depth chassis
  • CPU maximum TDP of up to 250W or 225W EE SKUs with 8 DIMMs and support
  • Front access for easy maintenance
  • 2 x Intel 10GbE Base-T ports + 1 x Management port
  • Design for NEBS



EG520-E11 was designed for Short-depth chassis and front access design for space-limited edge environment 2U Intel single-socket compact edge and 5G server with front I/O access, wide temperature, 2 FHHL card, 3 FHFL cards and 2 M.2. Redundant DC PSU and support for critical environment temperature. Design for NEBS and supports Time-sync NIC and FEC FPGA for telecom applications.

Powered by 5th Gen Intel Xeon SP processors and supports Intel vRAN Boost technology*
The 5th Gen Intel® Xeon® Scalable Processors are designed to accelerate performance across the fastest-growing workloads that businesses depend on today Built-in accelerators improve performance across AI, analytics, networking, storage, and HPC. EG520-E11 series supports single Intel Scalable processors to enable up to 8 DIMM slots, all flash and PCIe Gen 5.0

Short-depth chassis and front access design for space-limited, edge environments
Supports Time-sync NIC and FEC FPGA for telecommunications applications

NVIDIA GPU Support
Up to 2 dual-slot GPU in 2U system and optimized acceleration for workloads across cloud, data center and for hybrid cloud environment.

PCIe 5.0 Ready
PCI Express® (PCIe®) 5.0 delivers 32GT/s bandwidth, which is twice the speed of PCIe 4.0, and offers lower power consumption, better land scalability and backwards compatibility.

Enhanced Security
PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

Comprehensive IT infrastructure management solution
EG520-E11 series features an embedded ASMB11-iKVM (BMC, AST2600) to provide comprehensive out-of-band and in-band management capability.

Specification
Processor/CPU1 x Socket E (LGA 4677)
5th Gen Intel® Xeon® Processor Scalable Family (Up to 250W or 225W EE SKUs) or
4th Gen Intel® Xeon® Processor Scalable Family (Up to 250W or 225W EE SKUs)
MemoryTotal Slots: 8 (8-channel, 1 DIMM per channel)
Capacity: Maximum 2048GB
Memory Type:
4th - DDR5 4800 MHz RDIMM/3DS RDIMM (1DPC)
5th - DDR5 5600 MHz RDIMM/3DS RDIMM (1DPC)
Memory Size:
256GB, 128GB, 64GB, 32GB, 16GB
Expansion SlotsTotal Slots: 5
Slot Type:
1x FHHL card (x16) or 2x FHHL cards (x8/x8)+
2x FHFL cards (x16/x16) or 3x FHFL card (x16/x8/x8)
Storage Bays4x 2.5' Front Hot-swap drive bays(NVME/SATA)+
2x E1.S (optional for E1.S SKU)
2x M.2 (22110/2280, PCIe) Gen5 x8 Link
NetworkingLAN:
2 x 10GbE LAN port
1 x Dedicated management port (BMC, AST2600)
SecurityOptional TPM-SPI module
Optional PFR module(by request)
Front I/O Ports1 x VGA port
2 x USB 3.2 Gen1 ports
2 x RJ-45 10G LAN port
1 x RJ-45 Mgmt. LAN port
1 x RJ-45 Console port
Rear I/O Ports2 x USB 3.2 Gen1 ports
1 x VGA port
Switch/LEDFront Switch/LED:
1 x Power Switch (w/ LED)
1 x Location Switch (w/ LED)
1 x Message LED
2 x LAN LED
1 x HDD LED
1 x reset button
Rear Switch/LED:
1 x Power Switch w/ LED
1 x Location Switch w/ LED
1 x Message LED
1 x reset button
OS SupportWindows Server 2019/2022, Ubuntu 22.04. LTS,
RHEL 8.X/9.X, SLES 15, Rocky Linux 8.X/9.X
Management
Solution
Out of Band Remote Management: ASMB11-iKVM (BMC, AST2600)
Dimension399mm x 438.5mm x 87mm(2U)
15.71" x 17.26" x 3.43"
Net Weight Kg
20.5kg (approximate) (CPU, DRAM & HDD not included)
Gross Weight Kg
22kg (approximate) (CPU, DRAM & HDD not included, Packing include)
Power Supply
1+1 Redundant AC/DC
1300W 50.5MM SLIM Platinum Power Supply
EnvironmentOperation temperature: 0℃ ~ 55℃
Non operation temperature: -40℃ ~ 70℃
Non operation humidity: 20% ~ 90% ( Non condensing)
Note: Operating Temperature based on configurations


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