READY FOR PRODUCTION
All boards can be used by the customer as "ready products". No custom hardware design is required where the available peripherals of standard carrier boards fit the application requirements.
SCALABILITY
The carrier boards are based on MicroSOM modules. This feature makes carrier board extremely flexible and allows the customer to make different products, with different performance and cost-optimized, using the same carrier board.
Specification | |
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General | MicroGEA Module compliant |
Ethernet | 1x 10/100 Ethernet interface |
Wireless | Wi-Fi and Bluetooth, Sterling LWB5+ module Global LTE with SIM connector |
USB | 1x USB Type A |
Peripheral | 1x microSD 1x RS485 (or CAN Bus optional) 1x RS232 1x RS232 for OS Console |
Form Factor | For MicroSOM module |
Dimension | 80 x 50 mm |
Operating Temperature | Industrial: -40°C to 85°C |
Standard Input | 7 to 40 Vdc single power supply |
Operating System | Linux Yocto |
Ordering Guide | |
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0027L210111810 | MicroDev 3.0 IOT board MX6ULL (MicroGEA MX6ULL 800MHz, 512MB DDR3, 512MB NAND, Ethernet, 2xRS232, 1xUSB, 1xSD, Industrial, RS485, RTC+Supercap, WiFi+BT LWB5+, LTE SIM7600G Global, Exp. Connector) |
0027L210121810 | MicroDev 3.0 IOT board CAN (MicroGEA MX6ULL 800MHz, 512MB DDR3, 512MB NAND, Ethernet, 2xRS232, 1xUSB,1xSD, Industrial, CAN, RTC+Supercap, WiFi+BT LWB5+, LTE SIM7600G Global, Exp. Connector) |
0027L610111810 | MicroDev 3.0 IOT board STM32MP1 (MicroGEA STM32MP157 2x650MHz, 512MB DDR3, 512MB NAND, Ethernet,2xRS232, 1xUSB, 1xSD, Industrial, RS485, RTC+Supercap, WiFi+BT LWB5+, LTE SIM7600G Global, Exp. Connector) |