RS700A-E11-RS12U

1U server with dual AMD EPYC™ 7003 CPUs, 32 DIMMs, 1 dual-slot GPU, 12 NVMe, 3 PCIe 4.0 slots, OCP 3.0, and M.2



Features

  • Dual AMD EPYC™ 7003 processors (280W)
  • 1x dual-slot or 2x single-slot GPUs for AI workloads
  • Up to 12x all-flash NVMe drives on front panel designed
  • Up to 3x PCIe® 4.0 slots
  • Onboard LAN-module design to enable 4x 1GbE or 2x 10GbE LAN options
  • Flexible cooling solution
  • Remote management
  • Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency
  • Redundant 1600W/1200W 80 Plus Platinum power supplies



RS700A-E11-RS12U is designed to accelerate application performance leveraging accelerator cards and storage scalability. With the CPU and memory configured in a front parallel design that enables efficient airflow for excellent thermal performance, RS700A-E11-RS12U is optimized for rack placement.

AMD EPYC 7003 Series Processors
The latest AMD EPYC™ 7003 series processors are the new standard for modern data centers. AMD was first with X86 multi-chip-module server CPUs and continues to innovate with the 3rd Gen EPYC processors, including up to 32MB of L3 cache per core and synchronized fabric and memory-clock speeds designed for improved performance.

PCIe 4.0 Ready
PCI Express® (PCIe®) 4.0 delivers 16 GT/s bandwidth, which is double the speed of PCIe 3.0, offering lower power consumption, better lane scalability and backwards compatibility. RS700A-E11 servers are PCIe 4.0 ready to support a diverse array of graphics, storage and networking – enabling flexible scalability for demanding or increasing workloads.

GPU and FPGA Support
RS700A-E11 servers feature a powerful GPU architecture that supports one dual-slot GPU such as NVIDIA A100 in one 1U system to enable easy scale-up in order to meet the demands of AI and high-performance computing (HPC), and to securely run workloads in virtualized environments.
AMD EPYC 7003-based series are Xilinx Alveo-qualified servers to provide optimized acceleration for workloads across cloud and on-premises data centers, and for hybrid cloud environments in financial computing, machine learning, computational storage, and data search and analytics.

CPU-balanced Architecture
This architecture extends the full bandwidth to either dual- or single-CPU configurations, enabling more computing capability and much-improved overall power efficiency for compute-intensive workloads. This architecture allows customers to take full advantage of bandwidth capabilities of the dual-CPU architecture with a single CPU, while offering the flexibility to upgrade later with the addition of a second CPU.

Scalable storage solution
RS700A-E11 servers feature scalable storage solutions to support maximum performance for data center flexibility, and enable industry-standard SAS/SATA/NVMe interfacing through Broadcom Tri-Mode RAID adapters for increased connectivity and security. Up to 12x all-flash NVMe drives on front panel enable extensive storage and high-throughput performance.

Cooling Solutions
Data centers typically demand high-performance processors, GPUs or memory in dense configurations to run HPC or AI workloads. RS700A-E11 servers feature either air or liquid-cooled solutions, with Asetek’s Direct-to-Chip (D2C) liquid-cooling technology achieving lower power-usage effectiveness (PUE) and optimized TCO for data centers.

Enhanced Security
PFR FPGA as the platform Root-of-Trust solution for firmware resiliency to prevent from hackers from gaining access to infrastructure. In addition, all RS700A-E11 servers also include support Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.
*Both PFR and TPM are options, available on request.

OCP 3.0
RS700A-E11 servers feature the latest OCP NIC 3.0 card with PCIe 4.0 bandwidth for a faster time-to-market network solution, delivering the speeds of up to 200 Gbps for high bandwidth and low latency. It also features a tool-less, hot-swappable design to simplify installation and serviceability.


Specification
Processor / System Bus
2 x Socket SP3 (LGA 4094)
AMD EPYC™ 7003 Series
AMD EPYC™ 7002 Series
Max TDP : 280W
Generation
E11
MemoryTotal Slots :
32 (8-channel per CPU, 16 DIMM per CPU)
Capacity :
Maximum up to 4096GB RDIMM
Memory Type :
Dual Channel DDR4 3200/2933 RDIMM
Dual Channel DDR4 3200/2933 LRDIMM
Dual Channel DDR4 3200/2933 LR-DIMM 3DS non ECC
Memory Size :
64GB, 32GB, 16GB RDIMM
128GB, 64GB LRDIMM
256GB, 128GB, 64GB LR-DIMM 3DS
Graphic Card
Please refer to GPU support list 
Expansion Slots

Up to 3 x Expansion slots + 1 x Internal PIKE slot
1 x PCIe Gen4 x16, FHFL (CPU1)
1 x PCIe Gen4 x16, FHFL or OCP3.0 (CPU2)
1 x PCIe Gen4 x8 or x16, LP (if PCIe M.2 in use, it will operate at x8 link) (CPU2)

*Installing GPU cards will occupied expansion slots.
Storage
Storage Controller :
12 x SATA3 6Gb/s ports (SATA 6Gb/s & PCIe® Gen4 x4 link)
2 x M.2 connector(2242/2260/2280/22110) both SATA & PCIe mode
SAS Controller :
ASUS PIKE II 3008-8i 8-port SAS 12G RAID card(Optional)
ASUS PIKE II 3108-8i 8-port SAS 12G HW RAID card(Optional)
Broadcom MegaRAID 9560-16i (Optional)
Drive Bays
12 x 2.5" hot-swap drive bays (12 x NVMe/SATA/SAS)
2 x M.2 (support SATA/PCIe M.2) (up to 22110) (CPU2)
System Fan
8
Networking
Option 1
1 x Quad Port Intel I350-AM4 1G LAN Controller + 1 x Mgmt LAN
or
Option 2
1 x Dual Port Intel X710-AT2 Gigabit 10G LAN Controller + 1 x Mgmt LAN
or
None
GraphicAspeed AST2600 with 64MB VRAM
Rear I/O Ports

2 x USB 3.2 Gen1 ports
1 x VGA port
1 x RJ-45 Mgmt LAN port
1 x OCP3.0 port (Please remember to insert OCP3.0 Board)
Switch/LEDFront Switch/LED:
1 x Power switch (w/LED)
1 x Reset Switch
1 x Location Switch (w/LED)
1 x HDD Access LED
1 x Message LED LAN 1-4 LED (on NIC Module)

Rear Switch/LED:
1 x Power switch w/LED
1 x Port 80 LED(Q-Code)
1 x Location Switch w/LED
1 x Message LED
Management Solution
On-Board ASMB10-iKVM for KVM-over-IP
ASUS Control Center Enterprise (Optional)
Regulatory ComplianceBSMI, CE, FCC(Class A)
Dimensions842.5mm x 449mm x 43.85mm (33.17" x 17.68" x 1.73")
Form Factor
1U
WeightNet Weight : 18.85KG
Gross Weight : 23.89KG
Power Supply1+1 Redundant 1200W/1600W 80 PLUS Platinum Power Supply
Rating: 100-127/200-240Vac,9.4A/4.72A (x2) ,50/60Hz Class I (240Vdc, 4.6A Only for China)

*1600W RPSU is required while choosing GPU SKU
EnvironmentOperation temperature: 10℃ ~ 35℃
Non operation temperature: -40℃ ~ 60℃
Non operation humidity: 20% ~ 90% (Non condensing)
Optional ItemsStandard Cooling Solution or
Water Cooling Solution
Note
*If only 1 CPU is installed, some functions might be not available.
* SAS support only from SAS HBA/RAID Card
CPU Heatsink/ Cooler2
Fan1 (For supporting GPU SKU, it will have external fan)


Ordering Guide
RS700A-E11-RS12U-WOCPU009Z Upcoming 4x NVMe + 8x SAS/SATA + 1G (1200W)
RS700A-E11-RS12U-WOCPU01 Upcoming 4x NVMe + 8x SAS/SATA + 1x Dual GPU suport + 10G (1600W)
RS700A-E11-RS12U-WOCPU013Z Upcoming 12x NVMe/SAS/SATA + 10G (1200W)

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