RS720-E10-RS12E

2U server with dual 3rd Gen Intel® Xeon® CPUs, 32 DIMMs, 4 dual-slot GPUs, 8 NVMe, 9 PCIe 4.0, OCP 3.0 and M.2



Features

  • Dual 3rd Gen Intel CPUs (270W) with 32 DIMMs (Ice Lake)
  • Optional GPU-optimized design allows 4 dual-slot GPUs for AI workloads
  • Up to 8x all-flash NVMe, 4x SATA/SAS drives (front), and 2x optional NVMe (rear)
  • Up to 9x PCIe® 4.0 slots
  • Flexible onboard LAN-module design to enable 4x 1GbE or 2x 10GbE LAN options
  • Flexible air- and liquid-cooling solution
  • Remote management
  • Integrated PFR FPGA as the platform Root-of-Trust solution for TPM 2.0
  • Redundant 2400W 80 Plus® Platinum power supplies



RS720-E10-RS12E is a 2U dual-socket server powered by 3rd Gen Intel® Xeon® Scalable processors that supports up to 32 DIMMs, 12 front bays, 9 PCIe 4.0 slots, OCP 3.0 and M.2.

3rd Gen Intel® Xeon® Scalable Processors & PCIe 4.0 Ready
The latest Intel® Xeon® scalable processors offer up to 1.42x more cores per CPU and 1.52x computing performance increase. RS720-E10-RS12E supports dual Intel Scalable processors to enable up to 32 DIMM slots, all flash and PCIe Gen 4.0. PCI Express® (PCIe®) 4.0 delivers 16 GT/s bandwidth, which is double the speed of PCIe 3.0, offering lower power consumption, better lane scalability and backwards compatibility.

Four Dual-slot GPUs Support
RS720-E10 servers feature a powerful GPU architecture that supports up to 4x dual-slot GPUs such as NVIDIA A100 in one 2U system to enable easy scale-up in order to meet the demands of AI and high-performance computing (HPC), and to securely run workloads in virtualized environments.

Cooling Solutions
Air or liquid-cooled solutions. Asetek’s Direct-to-Chip (D2C) liquid-cooling technology achieving lower power-usage effectiveness (PUE) and optimized TCO for data centers.

Enhanced Security
PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

Specification
Processor / System Bus2 x Socket P+ (LGA 4189) Option 1
3rd Gen Intel® Xeon® Scalable Processors Family(270w)
UPI (11.2 GT/s)
GenerationE10
Core LogicIntel® C621A Chipset
MemoryTotal Slots:
32 (8-channel per CPU, 16 DIMM per CPU) Option 1
Capacity:
Maximum up to 6TB RDIMM
Memory Type:
DDR4 3200/2933 RDIMM
DDR4 3200/2933 LRDIMM
DDR4 3200/2933 LR-DIMM 3DS
3200/2933 RDIMM 3DS
Memory Size:
64GB, 32GB, 16GB, 8GB RDIMM
256GB, 128GB, 64GB RDIMM 3DS
128GB RDIMM 3DS/LR-DIMM 3DS
512GB, 256GB, 128GBIntel® Optane™ DC persistent memory 200 Series (DCPMM)
Graphic CardNVIDIA® Quadro RTX 6000 24GB GDDR6
NVIDIA® Quadro RTX 5000 16GB GDDR6
Expansion Slots(GPU):
Slot 1, 2: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, FL (CPU1)
Slot3: 1 x PCI-E x16 (Gen4 x16 link), FH, HL (CPU1)
*Can be converted to OCP3.0 slot
*Support FL card if external GPU fan in use
Slot 4: 1 x PCI-E x8 (Gen4/Gen3 x8 link), FH, HL (CPU1)
*Option for PIKE II
Slot 5,6: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, FL (CPU2)
Slot 7,8: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, FL (CPU2)
Slot 9: 1 x PCI-E x16 (Gen4 x16 link), LP, HL (CPU2)
*Optional for COM Cable
*Will drop to x8 if M.2 in sue
(Non-GPU)
Slot 1, 2: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, HL (CPU1)
Slot3: 1 x PCI-E x16 (Gen4 x16 link), FH, HL (CPU1)
*Can be converted to OCP3.0 slot
Slot 4: 1 x PCI-E x8 (Gen4/Gen3 x8 link), FH, HL (CPU1)
*Option for PIKE II
Slot 5,6: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, HL (CPU2)
Slot 7,8: 2 x PCI-E x16 (Gen4 x8 link) or 1 PCI-E x16 (Gen4 x16 link), FH, HL (CPU2)
Slot 9: 1 x PCI-E x16 (Gen4 x16 link), LP, HL (CPU2)
*Optional for COM Cable
*Will drop to x8 if M.2 in sue
2 x M.2 (Up to 2280, PCIe)
Storage
Storage Controller:
12 x SATA3 6Gb/s ports
Intel® Rapid Storage Technology Enterprise(RSTe) (For Linux/Windows)
(Support Software RAID 0, 1, 5, 10 )
Intel®VROC (For Linux/Windows)
(Support Software RAID 0/1/5/10 )

SAS Controller:
ASUS PIKE II 3008-8i 8-port SAS 12G RAID card
ASUS PIKE II 3108-8i 8-port SAS 12G HW RAID card
Broadcom MegaRAID 9560-16i
Drive Bays12 x 2.5“/3.5” Hot-swap Storage Device Bays up to
8x NVMe/SATA*/SAS*+ 4x SATA*/SAS*
*must with PIKE II 3008-8i, 3108-8i/16PD(slot4) to support up to 12x SATA/SAS
*Support tri-mode card
2 x 2.5" Hot-swap Storage Rear Bay (SATA/NVME)
System Fan4
Networking4 x Quad Port Intel I350-AM4 1G LAN Controller + 1 x Mgmt LAN
2 x Dual Port Intel X710-AT2 Gigabit 10G LAN Controller + 1 x Mgmt LAN
GraphicAspeed AST2600 with 64MB VRAM
Front I/O Ports2 x USB 3.2 Gen 1 ports
Rear I/O Ports2 x USB 3.1 Gen1 ports
1 x VGA port
2 or 4 x RJ-45 GbE LAN ports
1 x RJ-45 Mgmt LAN port
Switch/LEDFront Switch/LED:
1 x Power switch/LED
1 x Location switch/LED
1 x Reset switch
1 x HDD Access LED
1 x Message LED
LAN 1-4 LED
* LAN3-4 for Mezzazine card use

Rear Switch/LED:
1 x Power switch
1 x Q-Code/Port 80 LED
1xMessage LED
1xHDD LED
1x Location LED
Management SolutionASUS Control Center(Classic) On-Board ASMB10-iKVM for KVM-over-IP
Regulatory ComplianceBSMI, CE, FCC(Class A)
Dimensions840mm x 447mm x 88mm(2U)
33.07" x 17.60" x 3.46"
Form Factor2U
WeightNet Weight :18.195KG
Power Supply1+1 Redundant
2400W 80 PLUS Titanium Power Supply
1600W 80 PLUS Platinum Power Supply
(240Vdc Only for China)
EnvironmentOperation temperature: 10℃ ~ 35℃
Non operation temperature: -40℃ ~ 60℃
Non operation humidity: 20% ~ 90% ( Non condensing)


Ordering Guide
RS720-E10-RS12E 2U server with dual 3rd Gen Intel® Xeon® CPUs, 32 DIMMs, 4 dual-slot GPUs, 8 NVMe, 9 PCIe 4.0, OCP 3.0 and M.2

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