RS720Q-E10-RS8U

Great Scalability and Intel 3rd Gen High Performance Computing (HPC) Multi-Node Server with Direct to Chip Liquid Cooling Solution



Features

  • Powered by dual-socket Intel 3rd Gen Scalable processors with DDR4 Memory up to 3200MHz
  • One PCIe 4.0 x16 slot and One OCP 3.0 module per node
  • 8 x 2.5” Hot-swap Drive Bays support 8 x NVMe
  • 3000W 80 Plus® Titanium power supplies
  • ASPEED AST2600 controller



RS720Q-E10-RS8U is the ideal multi-node server powered by 3rd Gen Intel® Xeon Scalable processors, with each node supporting up to 16 DIMM, one PCIe® 4.0 slot, one OCP 3.0 and two M.2, and a total of eight NVMe/SAS/SATA drives.

3rd Gen Intel Xeon Scalable processors
The RS720Q-E10-RS8U is built with the 3rd Intel® Xeon® Processor Scalable Family with 16 DDR4 Memory up to 3200MHz, and designed for the demand of high scalability, high density computing, and wide range of existing and emerging workloads.

PCIe 4.0 Ready
PCI Express® (PCIe®) 4.0 delivers 16 GT/s bandwidth, which is double the speed of PCIe 3.0, offering lower power consumption, better lane scalability and backwards compatibility. Cooling Solution Air or liquid-cooled solutions. Asetek’s Direct-to-Chip (D2C) liquid-cooling technology achieving lower power-usage effectiveness (PUE) and optimized TCO for data centers.

Enhanced Security
PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

Specification
Processor / System Bus2 x Socket P+ (LGA 4189) per Node
3rd Gen Intel® Xeon® Scalable Processors Family(205W)
UPI (11.2 GT/s)
GenerationE10
Core LogicIntel® C621A Chipset
MemoryTotal Slots: 16 (8-channel per CPU, 8 DIMM per CPU) per Node
Capacity: Maximum up to 6144GB RDIMM
Memory Type:
DDR4 3200/2933 RDIMM
DDR4 3200/2933 LRDIMM
DDR4 3200/2933 LR-DIMM 3DS
Memory Size:
128GB, 64GB, 32GB, 16GB RDIMM
256GB, 128GB, 64GB RDIMM 3DS
128GB, 64GB, 32GB LR-DIMM 3DS
512GB, 256GB, 128GBIntel® Optane™ DC persistent memory 200 Series (DCPMM)
Expansion SlotsPer Node:
1 x PCI-E x16 (Gen4 x16 link), LP, HL (CPU1)
1 x OCP 3.0 Mezzanine (Gen4 x16 link) (CPU1)
2 x M.2 (Up to 2280, PCIe, SATA) (CPU1)
Storage
Per Node:
SAS/SATA Controller :
LSI 3008 8-port SAS 12G Controller (Optional)
Drive Bays8 x 2.5" Hot-swap Storage Bays(All Support SATA/SAS/NVMe)

* each node could control 2 drives.
NetworkingPer Node:
1 x Dual Port Intel I350-AM2 Gigabit LAN controller + 1 x Mgmt LAN
GraphicAspeed AST2600 with 64MB VRAM
Rear I/O PortsPer Node:
2 x USB 3.0 ports
1 x VGA port
1 x RJ-45 GbE LAN ports
1 x RJ-45 Management port
Switch/LEDPer Node:
Rear:
1 x Power Switch/LED
1 x Q-Code/Port 80 LED
Front:
1 x Power Switch/LED
1 x Location Switch/LED
1 x Message LED
2 x LAN LED
Management SolutionASUS Control Center Enterprise (Optional)
ASMB10-iKVM for KVM-over-IP
Regulatory ComplianceBSMI, CE, FCC(Class A)
Dimensions800 x 444 x 88mm
31.5" x 17.48" x 3.46"
Form Factor2U
WeightNet Weight: 39 Kg
Gross Weight: 43 Kg
Power Supply1+1 Redundant 3000W 80 PLUS Titanium Power Supply
Rating: 200-240 Vac, 15.5A (x2), 50-60Hz
EnvironmentOperation temperature: 10℃ ~ 35℃
Operation temperature: 10℃ ~ 30℃ (for 205W CPU)
Non operation temperature: -40℃ ~ 60℃
Non operation humidity: 20% ~ 90% (Non condensing)
Processor Support2 x Socket P+ (LGA 4189) per Node
3rd Gen Intel® Xeon® processor Scalable family
(Up to 205W for air cooling, up to 350W for liquid cooling)
UPI 11.2 GT/s
Core LogicIntel® C621A PCH
MemoryTotal Slots:16 (8-channel per CPU, 8 DIMM per CPU)
Capacity:Maximum up to 8192GB per Node
Memory Type:DDR4 3200/2933 RDIMM, LRDIMM, LR-DIMM 3DS
Memory Size:
128GB, 64GB, 32GB, 16GB RDIMM
256GB, 128GB, 64GB RDIMM 3DS
128GB, 64GB, 32GB LR-DIMM 3DS
512GB, 256GB, 128GB Intel® Optane™ DC persistent memory 200 Series (DCPMM)
Expansion SlotsTotal PCI/PCI-X/PCI-E/PIKE Slots:Per Node
Slot Type:
-1 x PCI-E x16 (Gen4 x16 link), LP, HL
-1 x OCP 3.0 Mezzanine (Gen4 x16 link)
-2 x M.2 (Gen4 x4 link, up to 2280, PCIe, SATA)
Disk ControllerSATA Controller: The Same as SAS Controller
SAS Controller:Per Node
Broadcom SAS3008 (Support RAID 0, 1)
-2 x SAS 12Gb/s ports or
-2 x SATA 6Gb/s ports
NVMe Controller:Per Node
Intel® VROC (Support RAID 0, 1)
- 2 x NVMe ports
Storage BaysI = internal
A or S will be hot hot-swappable
-8 x 2.5" Hot-swap Storage Bays (SATA/SAS/ NVMe Supported)
NetworkingLAN:Per Node
-1 x Intel I210-AT Gigabit LAN controller
-1 x Management Port
GraphicVGA:
Aspeed AST2600 64MB
Front I/O PortsN/A
Rear I/O PortsPer Node:
2 x USB 3.0 Ports
1 x VGA Port
1 x RJ-45 GbE LAN Ports
1 x RJ-45 Management Port
Switch/LEDPer Node:
Rear :
1 x Power Switch/LED
1 x Q-Code/Port 80 LED

Front :
1 x Power Switch/LED
1 x Location Switch/LED
1 x Message LED
2 x LAN LED
Management
Solution

Software: ASUS Control Center (Classic)
Out of Band Remote Management: On -Board ASM10 ASM10-iKVM for KVM KVM-overover-IP

Dimension800mm x 444mm x 88mm(2U), 31.5" x 17.48" x 3.46
35.5kg
Net Weight Kg (CPU, DRAM & HDD not included)
Gross Weight Kg41.5 kg
(CPU, DRAM & HDD not included, Packing included)
Power Supply1+1 Redundant 3000W 80 PLUS Titanium Power Supply
Rating: 220-240 Vac, 15.5A (x2), 50-60Hz, Class I
(following different configuration by region)
EnvironmentOperation temperature: 10℃ ~ 35℃ (for < 205W CPU, with air cooling)
Operation temperature: 10℃ ~ 30℃ (for 205W CPU, with air cooling)
Operation temperature: 10℃ ~ 35℃ (for > 205W CPU, with liquid cooling)
Non operation temperature: -40℃ ~ 60℃
Non operation humidity: 20% ~ 90% (Non condensing)


Ordering Guide
In Process Great Scalability and Intel 3th Gen High Performance Computing (HPC) Multi-Node Server with Direct to Chip Liquid Cooling Solution

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