Portwell’s COM-HPC® Modules and Carriers

High-Performance Computing Solutions

To fulfill the growing demand of high-performance computing and high-speed I/O interfaces, American Portwell offers the complete portfolio of COM-HPC Server and Client type modules and carriers, as well as technical and customization support for customers in applications including embedded server equipment, ruggedized PCs, medical equipment, transportation and defense systems, and much more.

PICMG’s COM-HPC (High-Performance Computing) computer-on-module specification includes Server and Client types to complement COM Express. COM-HPC supports higher power budget, more expansions and improves the speed of the I/O interface with PCIe Gen 4 or Gen 5 (32GT/s), USB 3.2 Gen 2x2 (20Gbps) or USB 4 (40Gbps), and 25GbE KR signals.

For more information about American Portwell’s upcoming products, please click the landing page here and contact us at info@portwell.com today.

COM-HPC Server Type Modules

Provide superior computing performance and enhanced network throughput including up to 65 lanes of PCIe, 8 KR Ethernet (25G/10G), and utilize CPU with TDP of up to 150W. Ideal for high-end embedded server and data center equipment requiring maximum performance and customizable I/O.


COM-HPC Server Size E Module (200 x 160mm)


Intel Xeon D-2700 Series SoC, up to 20C
DDR4 2933 MT/s up to 1024GB
4x 25/10GbE, 4x 10GbE and 1x 2.5GbE (Up to 100Gb throughput)
2x PCIe 4.0 x16 and 2x PCIe 3.0 x8 for high speed I/O cards, 1x PCIe Gen 3 x1 for BMC
On-board TPM 2.0 for hardware-based security
Industrial temperature range -40°C ~ +85°C

COM-HPC Client Type Modules

Support comprehensive high-speed I/O interfaces including 49 PCIe lanes and multiple media interfaces, featuring high-performance graphics, MIPI-CSI, Soundwire, I²S, and high-speed network interfaces of NBase-T and 25GbE KR signals. Ideal for high bandwidth and scalable network or IoT applications requiring one or more displays to address the needs of various applications


 COM-HPC Client Size A Module (125 x 95mm)

• 11th Gen Intel Core SoC, up to 10C
• 4x PCIe Gen 4 and up to 10x PCIe Gen 3 lanes
• 2x 2.5GbE Base-T with vPro (Industrial SKUs)
• Supports Multimedia interface:
  - 3x DDI, 1x eDP/MIPI-DSI for display
  - 2x Soundwire,1x I²S for audio
  - 2x MIPI-CSI for camera
• Industrial temperature range -40°C ~ +85° 


 COM-HPC Client Size A Module (160 x 120mm)

• 10th Gen Intel Core/ Xeon W Series, up to 10C
• DDR4 2933MT/s up to 128GB
• 2x 2.5GbE with TSN capability
• 1x PCIe Gen 3 x16, 3x PCIe Gen 3 x4, and 8x PCIe Gen 3 x1 for high speed I/O cards, 1x PCIe Gen 3 x1 for BMC
• On-board TPM 2.0 for hardware-based security 

COM-HPC Carrier Boards

Flexible carrier options provide quick design prototyping of all Portwell COMe-HPC modules as well as design reference for customized carrier boards.


 COM-HPC Server type Carrier Board (305 x 330mm)

• Extended ATX Form Factor
• 1x PCIe Gen 4 x16, 4x PCIe Gen 4 x8, 2x PCIe Gen 4 x4, 2x NVME PCIe 3.0 x4 (2242/22602280), 2x 2.5GbE RJ45
• 4x USB 3.2 Gen 2, 4x USB 2.0, 2x SATA, 2x COM, and 1x VGA from BMC
• Industrial temperature range -40°C ~ +85°C



 COM-HPC Client Type Carrier Board (305 x 244 mm)

• ATX Form Factor
• 2x PCIe Gen 4 x16, 2x PCIe Gen 4 x4
• 2x M.2 M key, 2x 2.5GbE RJ45, DisplayPort, 4x USB 3.2 Gen 2, 6x USB 2.0, 2x SATA
• Industrial temperature range -40°C ~ +85°C
• Standard ATX PSU input

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American Portwell Technology

44200 Christy Street,
Fremont, CA 94538 (USA)

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