To fulfill the growing demand of high-performance computing and high-speed I/O interface, the PCI Industrial Computer Manufacturers Group (PICMG) has developed the new COM-HPC (High-Performance Computing) computer-on-module specification. COM-HPC uses the same concept as COM Express, but increases the connectors from 440 pins to 800 pins to support more expansions, and improves the speed of the I/O interface with PCIe Gen 4 or Gen 5 (32GT/s), USB 3.2 Gen 2x2 (20Gbps) or USB 4 (40Gbps), and 25G KR signals. COM-HPC has two module types, Server and Client. The Server type focuses on server applications, providing up to 65 lanes of PCIe, 8 KR Ethernet, and utilizes CPU with TDP of up to 150W. In contrast, the Client type provides 49 PCIe lanes and multiple media interfaces, featuring high-performance graphics, MIPI-CSI, Soundwire, I²S, etc. And it also provides high-speed networking interfaces of NBase-T and 25GbE KR signals to address the needs of various applications.

Portwell has initiated the development of COM-HPC Server and Client type modules and carriers to meet the demand of higher performance computing in applications including edge computing, 5G, IoT, AI, and much more. For more information about our upcoming products, please contact us at today.


COM-HPC is a new Computer on Module standard specifically developed for High-Performance Computing. It serves various of the same applications and markets as COM Express but with higher-end CPUs, more memory, and faster I/O.

Pin-Out2 x 220 pins
(Type 6/7)
2 x 400 pins
CPU PowerUp to 80 WattUp to 150 Watt
PCIe SpeedUp to Gen 4Up to Gen 5
PCIe Lanes24 for Type-6
32 for Type-7
4 for Type-10
48 + 1 for Client type
64 + 1 for Server type
NBASE-TUp to 1GbEUp to 10GbE
Ethernet-KR SpeedUp to 4x 10 GbpsUp to 8x 25 Gbps
USB SpeedUp to 4x USB 3.2 Gen 1Up to 4x USB 4
(Display/ Audio/ Camera)
(Type 6)
3x DDI
Dual 24-bit LVDS
1x eDP overlay LVDS
1x Analog VGA
1x HDA digital audio interface
(Client type)
3x DDI
1x eDP/DSI
2x Soundwire
1x I2S
Power12V12V or
Wide-range option for Client type B

COM-HPC ® Server: Provide superior computing performance and enhanced network throughput.

COM-HPC ® Client: Support comprehensive high-speed I/O interface.

FeatureCOM-HPC ClientCOM-HPC Server
SizeA, B, CD, E
PCIe48 + 1 (BMC)64 + 1(BMC)
Ethernet KR (Max. 25G)28
NBASE-T (Max. 10G)21
USB 2.088
*USB 3.2*4*2
*USB 4*4*2
Soundwire, I2S2, 10
eSPI, SPI1, 21, 2
SMB, I²C, IPMB1, 2, 11, 2, 1

*Note: All USB 3.2 and USB4 options are “upgrade” options: A USB 3.2 instance uses up a COM-HPC USB 2.0 port. A USB4 instance needs to use a USB 3.2 Gen 2x2 port (which in turn uses up a USB 2.0 port).



  • COM-HPC Server type, size E module
  • Intel Xeon D processor
  • Up to 768GB Quad-channel DDR4 2933MT/s Non-ECC on six ULP-DIMM sockets
  • 2x PCIe Gen 4 x16, 2x PCIe Gen 3 x8, 1x PCIe Gen 3 x1 for BMC
  • High-Speed Ethernet KR: 8x 10GbE or 4x 25GbE
  • 1x 2.5GbE Base-T Interface
  • 4x USB 3.2 Gen 1, 4x USB 2.0
  • Extended operating temperature: -40 ~ 85 °C (by CPU SKUs)

Sample available in 2021 Q4 [Preliminary]

PCOM-B801 [Preliminary]


  • COM-HPC® Server type, size D module
  • Intel® Xeon® D processor (Ice Lake-D LCC)
  • Coming soon

Sample available in 2021 Q4 November [Preliminary]

Server Type Carrier Board


  • Board Size: 305 x 370 mm
  • Compatible with COM-HPC Server type modules, size D & E
  • 8x 25G/10G Ethernet KR signal via 2x PCIe x8 slots
  • 1x NBase-T Ethernet connector up to 10G on board
  • A total of 65 PCIe lanes via
    • 2x PCIe Gen 4 x16 connectors
    • 1x PCIe Gen 3 x16 connector
    • 2x PCIe Gen 3 x8 connectors
    • 1x PCIe Gen 3 x1 connector
  • 4x USB 3.2 Gen 2, 4x USB 2.0 pin header, 2x SATA III ports
  • 2x I²C, 1x SMBus, 1x eSPI, 12x GPIO, 1x IPMB

Sample available in 2021 Q3 August [Preliminary]



  • COM-HPC® Client type, size C module
  • 10th Gen Intel® Core™/Xeon® W Processor, up to 10 cores/95W TDP (Comet Lake S)
  • Up to 128GB Dual-channel DDR4 2933MT/s on four SO-DIMM sockets
  • Multimedia interface
    • 1x eDP (Dual channel), 3x DDI (HDMI/DP) for display
    • I²S for audio
  • 2x 2.5GbE Base-T via Intel I225LM
  • 1x PCIe Gen 3 x16, 3x PCIe Gen 3 x4, 8x PCIe Gen 3 x1
  • Optional 1x PCIe Gen 3 x1 for BMC
  • 4x USB 3.2 Gen 2, 8x USB 2.0, 2x SATA III

Sample available in 2021 in Q3 August [Preliminary]

PCOM-B882 [Preliminary]


  • COM-HPC® Client type, size B module
  • 11th Gen Intel® Core™ Processor (Tiger Lake H)
  • Coming soon

Sample available on 2021 Q4 November [Preliminary]



  • COM-HPC® Client type, size A module
  • 11th Gen Intel® Core™ Processor, up to 4 cores/28W TDP (Tiger Lake-UP3)
  • Up to 64GB Dual-channel DDR4 Non-ECC 3200 MT/s on two SO-DIMM sockets, support In-Band ECC for industrial SKUs
  • 1x PCIe Gen 4 x4, 2x PCIe Gen 3 x1, 1x PCIe Gen 3 x2, 1x PCIe Gen 3 x4
  • Up to 10 PCIe Gen 3 lanes (x16/ x8/ x4/ x2/ x1) from PCH
  • 1x 1GbE Base-T, 1x 2.5GbE Base-T with vPro
  • Optional 4x USB 3.2 Gen 2
  • Support multimedia interface:
    • 3x DDI (HDMI/DP), 1x eDP/MIPI-DSI for display
    • 2x Soundwire, 1x I²S for audio
    • 1x MIPI-CSI for camera
  • Extended operating temperature: -40 ~ 85 °C (by CPU SKUs)

Sample available in 2021 Q3 August [Preliminary]

Client Type Carrier Board


  • Compatible with COM-HPC Client type modules, size A, B, and C
  • 2x 25G/10Gb Ethernet KR signals via PCIe x8 slot
  • 2x NBase-T Ethernet connector up to 10GbE via RJ45
  • A total of 49 PCIe lanes via
    • 4x PCIe Gen 4 x1
    • 3x PCIe Gen 4 x4
    • 2x PCIe Gen 4 x16
    • Optional : 1x PCIe x1 for BMC [Preliminary]
  • Support multimedia interfaces:
    • 1x eDP connector
    • 3x DP ports
    • MIPI-DSI connector [Preliminary]
    • Soundwire/ I²S for audio [Preliminary]
    • 2x MIPI-CSI connectors
  • 4x USB 3.2 Gen 2, 4x USB 2.0, 2x SATA III ports
  • Support wide-range power input
  • 1x LPC header for TPM
  • 2x I²C, 1x SMBus, 1x eSPI, 12x GPIO, 2x UART Rear I/O, 1x SPI

Sample available on 2021 Q3 August [Preliminary]