Portwell Launches New COM-HPC Server Type Size E Module with Intel® Xeon® D-2700 Processors |
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FREMONT, CALIF. — August 3, 2022 — American Portwell Technology, Inc.,(https://www.portwell.com) a wholly owned subsidiary of Portwell, Inc., a world-leading innovator for Industrial PC (IPC) and embedded computing solutions, a Titanium Partner of Intel® Partner Alliance and an Elite level of Solution Integration Partner in the NVIDIA® Partner Network (NPN), announces PCOM-B800GT, the latest addition to its computer-on-module (COM) family. According to Susan Wei, product marketing manager at American Portwell Technology, the new PCOM-B800GT is based on the newly-developed PICMG® COM-HPC® specification: a small form factor embedded computing solution that delivers server-class performance and accelerated AI for rugged applications. “The new PCOM-B800GT is driven by a COM-HPC Server Type E module with Intel® Xeon® D-2700 processors (codenamed Ice Lake D),” Wei explains. “Dimensions of COM-HPC Server Type Size E are a mere 200mm x 160mm,” she adds. Features of PCOM-B800GT include DDR4 2933 MT/s up to 1024GB; 8x 10G KR, 1x 2.5GbE, 4x USB 3.2 Gen 1/USB 2.0, 2x SATAIII, 2x UART; 48x PCIe lanes: 2x PCIe Gen 4 x16 from CPU (bifurcation support—x16, x8, x4), 2x PCIe Gen 3 x8 (bifurcation support—x8, x4, x2, x1); AI workload acceleration with Intel AVX-512 VNNI (Vector Neural Network Instructions), and Intel DL (Deep Learning) Boost; industrial temperature range from -40°C through +85°C (selected SKUs); TDP 65W to 118W power consumption; on-board TPM 2.0 for hardware-based security. Portwell’s PCOM-B800GT utilizes the PCOM-C800 carrier board for functional testing and software development. Perfect for High-Performance Network Computing and Control Applications COM & COM-HPC: Less Complexity and Risk; More Flexibility Product details: # # # To complement the COM Express specification and fulfill the growing demand of high-performance computing and more high-bandwidth I/O interfaces, the PCI Industrial Computer Manufacturers Group (PICMG) has developed the COM-HPC (High-Performance Computing) computer-on-module specification. COM-HPC uses the same concept as COM Express, while increasing the connectors from 440 pins to 800 pins to support more expansions, and improves the speed of the I/O interface with PCIe Gen 4 or Gen 5 (32GT/s), USB 3.2 Gen 2x2 (20Gbps) or USB 4 (40Gbps), and 25G KR signals. COM-HPC has two module types, Server and Client. The COM-HPC Server Type focuses on server applications, providing up to 65 lanes of PCIe, 8 KR Ethernet, and utilizes CPU with TDP of up to 150W. In contrast, the COM-HPC Client Type provides 49 PCIe lanes and multiple media interfaces, featuring high-performance graphics, MIPI-CSI, Soundwire, I²S, etc. And it also provides high-speed networking interfaces of NBase-T and 25GbE KR signals to address the needs of various applications. About American Portwell Technology Intel and Xeon are trademarks of Intel Corporation in the United States and other countries. All other products and company names referred to herein may be trademarks or registered trademarks of their respective companies or mark holders. |
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