Portwell Launches New COM-HPC Client Type Size B Module with Intel® Xeon® D-1700 Processors |
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FREMONT, CALIF. — October 26, 2022 — American Portwell Technology, Inc., (https://www.portwell.com) a wholly owned subsidiary of Portwell, Inc., a world-leading innovator for Industrial PC (IPC) and embedded computing solutions, a Titanium Partner of Intel Partner Alliance and an Elite level of Solution Integration Partner in the NVIDIA Partner Network (NPN), announces PCOM-B8800, the latest addition to its computer-on-module (COM) family. According to Orion Xu, product manager at American Portwell Technology, the new PCOM-B8800, based on the PICMG COM-HPC specification, is a small form factor embedded computing solution that delivers server-class performance and accelerated AI for embedded and rugged applications at the Edge. “COM-HPC increases scalability of COM Express to fulfill the growing demand of high-performance computing by providing a higher speed I/O interface,” Xu explains, “while retaining a compact footprint.” Driven by Intel’s Xeon D-1700 processors (codenamed Ice Lake-D LCC), features of PCOM-B8800 include 2x 25GbE KR; up to128GB dual-channel DDR4 ECC at 2666 MT/s on SO-DIMM sockets; 16x PCIe Gen 4 lanes (bifurcation support of x16, x8, x4) and 24x HSIO (bifurcation support of x8, x4, x2, x1); AI workload acceleration with Intel AVX-512 Vector Neural Network Instructions (VNNI) and Intel Deep Learning (DL) Boost; industrial temperature range of -40°C to +85°C (selected SKUs); CPU TDP 40W—67W; 1x onboard TPM 2.0; and legacy I/Os, including SPI, eSPI, SMBus, GPIO x12, 12C and UART x2. Moreover, the Intel Xeon D-1700 processors, with built-in AI acceleration and support for hard real-time computing, deliver major performance gains for IoT applications, and more specifically, with up to 2.32x faster on CPU performance gains, and up to 5.73x faster on improved AI inferencing, in reference to performance benchmark of Intel Xeon D-1746TER processor vs. previous-generation Intel Xeon D-1539 processor. The PCOM-B8800 utilizes the PCOM-C8800 carrier board for functional testing and software development.
Perfect Choice for Embedded and Rugged Applications at the Edge
Compact Yet Rugged ”The COM-HPC connector provides forward compatibility to fulfill the need for limitless scalability as a result of the ever-evolving digital transformation,” Feng explains, “and the demand for embedded computers to provide high-speed performance. Driven by the Intel Xeon D-1700 SoC processors, PCOM-B8800 is the perfect engine for rugged equipment that must run nonstop in the toughest environments.” “Furthermore, the computer-on-module (COM) design reduces the complexity and risk of developing and maintaining a product platform, while maintaining high flexibility for future upgrades. Not only that,” Feng continues, “but our customers also benefit from the peace of mind they get from the long life cycle support of 10+ years inherent with this product.” # # # About American Portwell Technology Intel and Xeon are trademarks of Intel Corporation in the United States and other countries. All other products and company names referred to herein may be trademarks or registered trademarks of their respective companies or mark holders. |
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