PCOM-B703G

Intel® Xeon® processors D-2100 NT Skylake-D family, with 2x DDR4 ECC DIMM sockets, 32 PCIe Gen3 lanes rearrangable for different combination of PCIe x16/x8/x4/x2/x1.






Features

  • Intel® Xeon® processor D-2100 NT series
  • DIMM DDR4 2667 ECC up to128GB
  • Support 4x USB3.0/2.0, 4x SATA III
  • PCIe Gen 3 expansion (re-arrangeable for different combination of PCIe x16/ x8/ x4/x2/ x1) up to 32 PCIe lanes
  • Support High speed Ethernet (4x XGMII/KR)
The PCOM-B703G, a Type 7 COM Express module, is designed with Intel® Xeon® processor D-2100 Skylake-D series. More specifically, based on the COM Express 3.0 specification's Type 7 pinout, when compared to the Type 6 pinout, trades all the graphics interfaces for four XGMII to support 10G ports, and more PCIe lanes, makes the PCOM-B703 ideal for applications in networking, micro server, switch, and communication appliance, requiring low power consumption while supporting high computing performance and communication throughput. The PCOM-B703 features four 10G management interfaces and two DDR4 DIMM sockets supporting up to 2667 MT/s and 128B ECC memory.

Specification
Form Factor (mm)Extended Form Factor COM Express (155 x 110mm)
TypeType 7
CPUIntel® Xeon® processor D-2100 NT Skylake series
ChipsetSoC
MemorySupport up to 128GB DDR4 ECC up to 2667MHz DIMM
USB-4x USB2.0
-4 sets of SSRX/SSTX to support USB3.0
PCI Express-1x PCIe x16 Gen3
-8x PCIe x1 Gen3
-2x PCIe x4 Gen3
Ethernet4x XGMII / KR to support 4x 10G
Storage Temperature-20°C ~ 70°C (-29°F~21°F)
Operating Temperature0°C ~ 60°C (-32°F~140°F)


Ordering Guide

    PCOM-B703GType 7, Extended Form Factor COM Express