PCOM-B65C

COM Express Type VI Compact Size Module based on AMD Ryzen™ Embedded 8000 Series Processors with DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen 2, Discrete TPM 2.0, eDP, SATA III



Features

  • AMD Ryzen™ Embedded 8000 Series Processors
  • Up to 8 Zen 4 cores and RDNA™ 3 graphics with up to 6 WGPs (Work-group Processors)
  • 2x DDR5-5600 non-ECC SO-DIMMs up to 96GB, 1x Gen4 x8, 1x Gen4 x2, and 6x Gen4 x1
  • 4x USB 3.2 Gen 2, 2x SATA, 3x DDI, VGA, eDP/LVDS
  • Supports optional Out-of-Band (OOB) management and onboard PCIe NVMe SSD
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The PCOM-B65C is a COM Express Compact module powered by the AMD Ryzen™ Embedded 8000 Series processors. It adheres to the COM Express COM.0 R3.1 specification and features AMD’s advanced “Zen 4” 4nm core architecture, RDNA™ 3 graphics, and XDNA™ NPU, delivering high-performance computing with a thermal design power (TDP) range of 28 to 45 watts, optimized for embedded use conditions. Additionally, the PCOM-B65C supports Out-of-Band (OOB) management, enabling remote power on/off, system reset, and BIOS updates.

The module supports PCIe Gen4 lanes and up to two DDR5 SO-DIMM slots with ECC or non-ECC memory, making it well-suited for mission-critical deployments and AI edge computing. It offers a rich I/O configuration, including up to 1x PCIe Gen4 x8, 1x Gen4 x2, and 6x Gen4 x1 lanes, along with four USB 3.2 Gen 2 ports, two SATA interfaces, and an optional onboard SSD of up to 1TB. With its compute performance and complete and flexible I/O capabilities, the PCOM-B65C is ideal for a wide range of embedded and industrial applications.

Specification
Form FactorCOM Express Type 6 Compact Size (95 mm x 95 mm)
CPUAMD Ryzen™ Embedded 8845HS; 8C/16T; 3.8GHz, max. turbo 5.1GHz; 8M cache; 45W TDP; 6x Graphics WGPs
AMD Ryzen™ Embedded 8840U; 8C/16T; 3.3GHz, max. turbo 5.1GHz; 8M cache; 28W TDP; 6x Graphics WGPs
AMD Ryzen™ Embedded 8645HS; 6C/12T; 4.3GHz, max. turbo 5.0GHz; 6M cache; 45W TDP; 4x Graphics WGPs
AMD Ryzen™ Embedded 8640U; 6C/12T; 3.5GHz, max. turbo 4.9GHz; 6M cache; 28W TDP; 4x Graphics WGPs
ECC Memory SupportSupports ECC Memory
BIOSAMI uEFI BIOS
Memory2x DDR5 SO-DIMM, up to 96GB, 5600 MT/s
StorageNVMe (Shared w/ SATA)
SATA2x SATA III
USB4x USB 3.2 Gen2
8x USB 2.0
Ethernet1x GbE LAN
PCIe1x PCIe Gen4 x8
1x PCIe Gen4 x2
6x PCIe Gen4 x1
Legacy I/O8x GPIO
1x I2C
1x SMBus
2x UART
SecurityTPM 2.0
DisplayeDP / LVDS eDP up to HBR3 3840 x 2160@120Hz
eDP / LVDS LVDS (24bit, dual channel) 1920 x 1200@60Hz
DDI 1/2/3 DP up to HBR3 3840 x 2160@120Hz
DDI 1/2/3 HDMI 2.1 3840 x 2160@120Hz
VGA 1920 x 1200@60Hz
Dimension95 mm x 95 mm (3.74' x 3.74')
Operating Temperature0 ~ 60 °C (32 ~ 140 °F)
Storage Temperature -40 ~ 85 °C (-40 ~ 185 °F)
Form FactorCOM Express Type 6 Compact Size (95 mm x 95 mm)
CPUAMD Ryzen™ Embedded 8845HS; 8C/16T; 3.8GHz, max. turbo 5.1GHz; 8M cache; 45W TDP; 6x Graphics WGPs
AMD Ryzen™ Embedded 8840U; 8C/16T; 3.3GHz, max. turbo 5.1GHz; 8M cache; 28W TDP; 6x Graphics WGPs
AMD Ryzen™ Embedded 8645HS; 6C/12T; 4.3GHz, max. turbo 5.0GHz; 6M cache; 45W TDP; 4x Graphics WGPs
AMD Ryzen™ Embedded 8640U; 6C/12T; 3.5GHz, max. turbo 4.9GHz; 6M cache; 28W TDP; 4x Graphics WGPs
ECC Memory SupportSupports ECC Memory
BIOSAMI uEFI BIOS
Memory2x DDR5 SO-DIMM, up to 96GB, 5600 MT/s
StorageNVMe (Shared w/ SATA)
SATA2x SATA III
USB4x USB 3.2 Gen2
8x USB 2.0
Ethernet1x GbE LAN
PCIe1x PCIe Gen4 x8
1x PCIe Gen4 x2
6x PCIe Gen4 x1
Legacy I/O8x GPIO
1x I2C
1x SMBus
2x UART
SecurityTPM 2.0
DisplayeDP / LVDS eDP up to HBR3 3840 x 2160@120Hz
eDP / LVDS LVDS (24bit, dual channel) 1920 x 1200@60Hz
DDI 1/2/3 DP up to HBR3 3840 x 2160@120Hz
DDI 1/2/3 HDMI 2.1 3840 x 2160@120Hz
VGA 1920 x 1200@60Hz
Dimension95 mm x 95 mm (3.74' x 3.74')
Operating Temperature0 ~ 60 °C (32 ~ 140 °F)
Storage Temperature -40 ~ 85 °C (-40 ~ 185 °F)
CertificationCE/FCC Class A
OSWindows 11, Ubuntu 24.04
Portwell Special FeaturePortwell Engineering Toolkits (PET), Remote Portwell Engineering Toolkits (RPET)


Ordering Guide
PCOM-B65C COM Express Type VI Compact Size Module based on AMD Ryzen™ Embedded 8000 Series Processors with DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen 2, Discrete TPM 2.0, eDP, SATA III

*Please refer to product datasheet for additional ordering information.


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